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Flexible Integrated Circuit Packaging

Technology #012-0012-li

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A flexible circuit maintains stable performance while bent around a finger.
Zhenyu Li, Bowei Zhang, Mona Zhagloul
Managed By
Jerry Comanescu
Licensing Associate (202) 994-8975
Patent Protection

Flexible IC/microfluidic integration and packaging

US Patent 9,116,145
Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics
Scientific Reports, 2013, v.3 page 1098

The George Washington University has invented a way to package integrated circuits (ICs) in a flexible, twistable, and stretchable format.  In addition to many applications in wearable electronics, flexible circuits can be useful in any situation where a circuit must conform to a non-uniform space, or allow for deflection during operation.

This method enables performance improvements over other flexible circuit technologies by allowing for the use of any standard IC on the market, including CMOS chips.  The process enables new applications to take advantage of the high performance, low cost, and scalability characteristics of available CMOS chips.

Liquid metal connections maintain robust functionality during bending and stretching.  These Gallium based metal alloy connections can also be used to create on-chip coils, antennas, and strain gauges, enabling a myriad of applications, including magnetic, RF, display, and sensing applications.  The inventors have demonstrated proof-of-concept in a diagnostic, lab-on-a-chip application by adding microfluidic sample delivery channels to the package design.  Beyond diagnostics, flexible packaging has broad applicability to consumer electronics.


  • Wearable Electronics
  • Deformable Electronics


  • Compatible with any available IC
  • Use proven, high performance, low cost CMOS chips